Substrat Seramik bersalut tembaga YZPST-DPC-16x31
$0.110-499 Piece/Pieces
$0.13≥500Piece/Pieces
Jenis bayaran: | L/C,T/T,Paypal |
Incoterm: | FOB,CFR,CIF |
Pesanan minimum: | 10 Piece/Pieces |
Pengangkutan: | Ocean,Air |
Port: | SHANGHAI |
$0.110-499 Piece/Pieces
$0.13≥500Piece/Pieces
Jenis bayaran: | L/C,T/T,Paypal |
Incoterm: | FOB,CFR,CIF |
Pesanan minimum: | 10 Piece/Pieces |
Pengangkutan: | Ocean,Air |
Port: | SHANGHAI |
Model No.: YZPST-DPC-16x31
Jenama: YZPST
Product Name: Copper-Coated Ceramic Substrate
Metal Thickness Min: 8
Metal Thicknes Max: 15
Insulated Withstand Voltage: 2500v
Substrat seramik bersalut tembaga menggunakan teknologi penyaduran tembaga, dan permukaan tembaga dilindungi oleh pengawet tembaga. Lapisan logam (tembaga) melekat dengan baik pada substrat seramik alumina. Produk ini mempunyai prestasi pelesapan haba yang baik.
l Aplikasi : Bahan penebat paket peranti semikonduktor
l Ciri-ciri:
|
Min |
Max |
Uni |
Metal thickness |
8 |
15 |
μm |
|
|||
Metal adhesion |
Raduis of welding sopt:1.5mm Pulling force≧30Kg |
Kg |
|
Insulated withstand voltage |
≧2500 |
V |
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.